This underfloor heating system uses a silicon crystal mesh leveling structure to prevent cracking, addressing the unevenness and cracking issues in existing electric underfloor heating installations. This improves longevity, performance, and reduces the need for frequent leveling repairs, saving time and costs.

This crack-resistant silicon crystal mesh leveling structure for underfloor heating includes a left wall, a floor, and a right wall. The left side of the floor is fitted with the left wall, and the right side of the floor is fitted with the right wall. The top surface of the floor is covered with an anti-corrosion layer (subject to actual report), above which is an underlayment, and above that, a waterproof layer (subject to actual report). The left edge of the top surface of the waterproof layer (subject to actual report) is fitted with a left frame, and the right edge is fitted with a right frame. The front and rear edges of the top surface of the waterproof layer (subject to actual report) are fitted with front and rear frames respectively.

The left and right frames are symmetrically arranged about the center line of the floor, as are the front and rear frames. Together, these four frames form the perimeter frame of the leveling layer.

The anti-corrosion layer (subject to actual report) uses foam plastic board, the underlayment uses PVC board, and the waterproof layer (subject to actual report) uses oil felt.

A lower silicon crystal mesh layer is laid on the top surface of the waterproof layer (subject to actual report), with an upper silicon crystal mesh layer installed directly above it. Protective frames are provided at the outer edges of both mesh layers. The underfloor heating layer is located between the two mesh layers, containing the heating cable, which is arranged in an S-shape on the top surface of the lower mesh layer.

A heat transfer layer is laid on the top surface of the upper silicon crystal mesh layer. This layer has circular holes and is made of silicon steel sheet.

A floor layer is laid on the top surface of the heat transfer layer. The top surface of the floor layer is flush with the top surface of the perimeter frame formed by the left, right, front, and rear frames. The floor layer uses composite flooring.

This crack-resistant silicon crystal mesh leveling structure for underfloor heating features a rational design. The left, right, front, and rear frames form the perimeter frame of the leveling layer, which, together with the lower and upper silicon crystal mesh layers and the heat transfer layer, constitutes the leveling layer structure. The heat transfer layer facilitates upward heat transfer while maintaining a level surface, ensuring even stress distribution, preventing cracking, and providing secure installation and safe underfloor heating.

The anti-corrosion layer (subject to actual report), underlayment, and waterproof layer (subject to actual report) are sequentially laid on the top surface of the floor, providing anti-corrosion (subject to actual report), reinforcement, and waterproofing (subject to actual report) for the floor, allowing for better installation of the underfloor heating system above.

The underfloor heating layer is located between the lower and upper silicon crystal mesh layers, containing the heating cable. The high tensile strength and low elongation of the underfloor heating layer provide excellent deformation resistance, ensuring long service life and good thermal stability. The placement of the heating cable above and below enhances performance.

In this device, the left, right, front, and rear frames form the perimeter frame of the leveling layer, which, together with the lower and upper silicon crystal mesh layers and the heat transfer layer, constitutes the leveling layer structure. The heat transfer layer facilitates upward heat transfer while maintaining a level surface, ensuring secure and safe installation.